Mediatek already has a strong position on the market of chipsets for smartphones primary and secondary level. And now the company is struggling to gain share in high-end segment of this market. Chipmaker has already submitted a top platform Helio X20 and architecture chipset X25 Helio with an even higher performance. And now the company working on the next generation flagship hardware platforms. As can be seen from recent leaks, the new chipset Mediatek Helio X30 will be built on 10-nm FinFET process from TSMC. He will keep 10-core 3-cluster architecture X20/X25, but will boast a more powerful configuration of the nuclei. Thus, in the composition of the chip includes two cores Cortex-A7x (Artemis) with a clock frequency of 2.8 GHz, four cores Cortex-A53, operating at a frequency up to 2.2 GHz and four cores Cortex-A35, with a clock frequency of 2 GHz. And as graphics in the chipset will use a 4-core PowerVR accelerator 7xxx.
Mediatek Helio X30 will be able to work with cameras with resolution up to 26 megapixels and dual camera system. The chipset will be 2% more productive than its predecessor and will boast 50% less power consumption. Provided therein and integrated support for LTE networks Cat 13.
Sources claim that, as in the case of Mediatek Helio X25, X30 new Helio for the first time will be an exclusive offer of one of the smartphone manufacturers. The most likely candidates for this role are referred to as the Chinese company Meizu and Lenovo. And the first smartphones based on it will appear in the beginning of next year.